Ceramic Laser Machining Ceramic Laser Machining
Various types of ceramic substrates: laser cutting, laser scribing, various types of sintered ceramics or low-temperature co-fired ceramics, such as alumina, zirconia, aluminum nitride, boron nitride, LTCC, LED ceramics Cutting and scribing of substrates, power component heat sink substrates, etc., UV laser processing has a small line width and high precision, which is suitable for various applications that require high precision.
Suitable materials: Al2O3, AlN, SiC, BN, Green Tape and other ceramic materials.
Drilling and cutting thickness: 0.5mm or less
Scribing thickness: 2mm or less
Processing aperture: 60μm or more
Taper: 0 ~ 5 degrees can be controlled arbitrarily
Machining accuracy: aperture ±1μm
Position accuracy: within 5μm
Processing area: 150mm*150mm
Leading industry advantage
1. The precision of cutting holes and marking is high, and the line width is fine.
2. Not limited by materials, all kinds of materials that cannot be completed by mechanical processing can be completed with micro-innovation.
3. Accept processing commissioned by many passive component factories at home and abroad.

Processable material depends on design and requirement:

• Micro cutting (5μm/1mm), etching (10μm), milling (10μm) and scribing (5μm/30:1/1mm)
• Micro holes drilling (1μm/1mm)
• Micro Patterning (5μm/30μm)

Processable material depends on design and requirement

Micro cutting (5μm/1mm), etching (10μm), milling (10μm) and scribing (5μm/30:1/1mm)

Micro holes drilling (1μm/1mm)

Micro Patterning (5μm/30μm)

Hole types : square hole,

round hole, perforation,

blind hole