• Laser micro-cutting is a non-contact process that can be used to manufacture various very complex shapes. Compared with traditional cutting or sawing, a very small cutting width or slit width can be obtained.
• Laser micro-cutting can also be used, for example, for the separation of final parts, or to leave lugs for subsequent final part removal. It can also be used to effectively remove areas within the substrate, thereby forming larger holes, grooves or windows.
• Laser cutting can not only produce the same linear cut as traditional cutting or sawing technology, but also because it can manipulate the beam in any direction, it can produce cuts of any shape in the original substrate material.
• Application of micro-cutting:
• Aluminum foil, film, micro mechanical parts, semiconductor wafer
• Cutting accuracy: minimum cutting width 5 microns (µm)
• Material thickness: Maximum material thickness 1 millimeter (mm) (depending on speed requirements)
• Micro-machinable materials: including transparent materials, metals, polymers, glass and ceramics, customer-specified materials need to be verifie

Sub-Contract Micro Cutting

Minimum Cut Size : 5 µm (microns)

Maximum Material Thickness : 1.2 mm (thicker materials will take much longer)

Suitable Materials : Most materials from soft plastics to Tungsten Carbide and Diamond

Ideal for : Accurately cutting foils, films, micro-mechanical parts and semiconductor wafers